Experts, scholars, and enterprise representatives discuss the latest advancements in electronic packaging at ICEPT 2026.

The 2026 International Conference on Electronic Packaging Technology (ICEPT 2026) was held from Aug 5 to 7 in Xi'an, capital of Northwest China's Shaanxi province.

More than 1,800 experts, scholars, and enterprise representatives from over 30 countries and regions gathered in Xi'an to discuss the latest advancements in electronic packaging.

Focusing on key challenges such as computing power adaptation, thermal management control, power consumption optimization, and mass-production cost control, the conference outlined clear technological iteration pathways and industrialization roadmaps. These insights provide a strong reference for packaging technology innovation and engineering implementation of all-scenario AI high-end chips.

The conference also highlighted that system-level advanced packaging and heterogeneous collaborative design will become the core development directions for the continuous upgrading and iteration of future AI computing power platforms.

For the first time, the number of enterprise representatives attending the conference surpassed that of universities and research institutes, reflecting deeper integration between academic research and engineering applications.

Established in China in 1994, ICEPT is one of the four premier conferences in the global electronic packaging field and the largest and most influential professional event of its kind in Asia.

The conference showcases emerging trends like advanced packaging, packaging materials and processes, heterogeneous integration, and system-in-package, gathering leading scholars and industry experts from international universities, research institutions, and integrated circuit enterprises.