Honored by the journal IEEE Transactions on Electromagnetic Compatibility, Liu Xiaokang, an alumni of Xi'an Jiaotong University (XJTU), was awarded the IEEE TEMC Richard B. Schulz Best Transactions Paper Award, becoming the only winner of this prize in 2021.
This honor recognized his contributions to the modeling of assembly wiring harnesses and analysis method for electromagnetic compatibility performance.
|Liu Xiaokang, an alumni of Xi'an Jiaotong University, wins the IEEE TEMC Richard B. Schulz Best Transactions Paper Award.
Liu, now an assistant professor at Polytechnic University of Milan(POLIMI), graduated from the XJTU-POLIMI program in electrical engineering. He has published 19 papers in well-known journals and at conferences at home and abroad.
The XJTU-POLIMI joint training program was initiated in 2011 as part of the Belt and Road Initiative.
So far, 61 students from XJTU have done exchanges with POLIMI, giving XJTU the opportunity to make its international talent training more innovative and open up communication channels with overseas universities.
To enhance mutual learning and exchanges, two professors from Liu's research team, Sergio A. Pignari and Flavia Grassi, have been serving as visiting professors at XJTU and have maintained educational and scientific cooperation with the School of Electrical Engineering.
The Institute of Electrical and Electronics Engineers (IEEE) is an international association of electronic technology and information science engineers. The IEEE TEMC Richard B. Schulz Best Paper Award is named after IEEE Life Fellow and internationally renowned scientist Richard B.Schulz.
Out of hundreds of papers published in the previous year by IEEE TEMC, only one best paper award and one best paper nomination are selected, making it the highest honor for academic papers in the field of electromagnetic compatibility.